When it comes to printed circuit boards (PCBs) companies must decide whether they will stick with a “no clean” process or a “cleaning” process. Professionals like those at QC Electronics say there are many factors to be considered, from the cost to rebuild the assemblies to the environment the PCB will be exposed to. A lot of electronics assembly equipment has evolved over the years to use a “no clean” process. While many companies have successfully used this process in the automotive, telecom, computer and industrial industries, there are many reasons to clean.
A “no clean process” involves using high rosin liquid fluxes, just like the traditional “RMA” solder pastes that worked with the white water gum rosin. This process reduces the overall cost per assembly, reduces material handling and decreases cycle time. At the same time, it reduces the cost to store cleaning chemicals and equipment. However, companies are facing a tough challenge to provide “no clean” materials that will produce reliable results and satisfy today’s standards.
There will always be a need, according to QC Electronics, to clean, to improve functionality and reliability of electronics. A cleaning process ensures that the equipment will continue to work properly and improve efficiencies in the business.